{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780020","patent":{"patent_number":"US-9780020","title":"Wiring substrate and semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-12-01T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A wiring substrate includes a wiring layer located on an insulation layer, and a protective insulation layer covering the wiring layer and the insulation layer. The protective insulation layer includes an opening that partially exposes the wiring layer. The wiring layer includes first and second metal layers. The first metal layer is located at a position corresponding to the opening and has a larger contour than the opening in a plan view. The second metal layer includes a pad portion, which covers upper and side surfaces of the first metal layer, and a wiring portion. The opening is extended in the protective insulation layer from an upper surface of the protective insulation layer to the upper surface of the pad portion by a distance that is shorter than that from the upper surface of the protective insulation layer to an upper surface of the wiring portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate and semiconductor device","description":"A wiring substrate includes a wiring layer located on an insulation layer, and a protective insulation layer covering the wiring layer and the insulation layer. The protective insulation layer include","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780020","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780020","citation_suggestion":"Patentable. \"Wiring substrate and semiconductor device\" (US-9780020). https://patentable.app/patents/US-9780020","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780020","json":"https://patentable.app/api/llm-context/US-9780020","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:25:32.743Z"}