{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780022","patent":{"patent_number":"US-9780022","title":"Substrate structure","assignee":null,"inventors":[],"filing_date":"2016-07-11T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer, a first conductive pillar layer, and a second conductive pillar layer. The first conductive wiring layer is disposed inside the dielectric material layer. The first conductive pillar layer having a first conductive pillar is disposed inside the dielectric material layer and between the first conductive wiring layer and the second conductive wiring layer. The second conductive pillar layer having a second conductive pillar is disposed on the second conductive wiring layer. The first conductive wiring layer and the second conductive wiring layer are electrically connected by the first conductive pillar layer. The second conductive pillar is a -shape conductive pillar, a -shape conductive pillar, or a -shape conductive pillar."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Substrate structure","description":"A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer,","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780022","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780022","citation_suggestion":"Patentable. \"Substrate structure\" (US-9780022). https://patentable.app/patents/US-9780022","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780022","json":"https://patentable.app/api/llm-context/US-9780022","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:17:58.803Z"}