{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780043","patent":{"patent_number":"US-9780043","title":"Wiring board, semiconductor package, and semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-12-08T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A wiring board includes: a first insulating layer which is made of an insulating resin containing a thermosetting resin as a main component; a recess portion formed in an upper surface of the first insulating a layer; a first wiring layer formed in the recess portion and comprising an upper surface exposed from the first insulating layer; a via wiring penetrating the first insulating layer in a thickness direction thereof and comprising an upper end surface exposed from the first insulating layer; a second wiring layer formed on the upper surface of the first insulating layer to contact the upper end surface of the via wiring and the upper surface of the first wiring layer; and a second insulating layer which is made of an insulating resin containing a photosensitive resin as a main component and which is formed on the upper surface of the first insulating layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring board, semiconductor package, and semiconductor device","description":"A wiring board includes: a first insulating layer which is made of an insulating resin containing a thermosetting resin as a main component; a recess portion formed in an upper surface of the first in","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780043","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780043","citation_suggestion":"Patentable. \"Wiring board, semiconductor package, and semiconductor device\" (US-9780043). https://patentable.app/patents/US-9780043","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780043","json":"https://patentable.app/api/llm-context/US-9780043","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:36:38.813Z"}