{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780046","patent":{"patent_number":"US-9780046","title":"Seal rings structures in semiconductor device interconnect layers and methods of forming the same","assignee":null,"inventors":[],"filing_date":"2015-11-13T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment device includes a semiconductor substrate and an interconnect structure over the semiconductor substrate. The interconnect structure includes a functional circuit region and a first portion of a seal ring spaced apart from the functional circuit region by a buffer zone. The device also includes a passivation layer over the interconnect structure and a second portion of the seal ring over the passivation layer and connected the first portion of the seal ring. The second portion of the seal ring is disposed in the buffer zone."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Seal rings structures in semiconductor device interconnect layers and methods of forming the same","description":"An embodiment device includes a semiconductor substrate and an interconnect structure over the semiconductor substrate. The interconnect structure includes a functional circuit region and a first port","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780046","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780046","citation_suggestion":"Patentable. \"Seal rings structures in semiconductor device interconnect layers and methods of forming the same\" (US-9780046). https://patentable.app/patents/US-9780046","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780046","json":"https://patentable.app/api/llm-context/US-9780046","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:15:32.359Z"}