{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780047","patent":{"patent_number":"US-9780047","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2016-11-22T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elements mounted on the first surface and the second surface of the first substrate; a second substrate adhered to the second surface of the first substrate and including a penetration part formed to accommodate the plurality of electronic elements mounted on the second surface of the first substrate and a second ground conductor connected to the first ground conductor; a molded portion encapsulating the plurality of electronic elements mounted on the first surface of the first substrate; and a shielding layer formed on outer surfaces of the molded portion and the first substrate and at least a portion of a side surface of the second substrate to shield electromagnetic waves."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elemen","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780047","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780047","citation_suggestion":"Patentable. \"Semiconductor package\" (US-9780047). https://patentable.app/patents/US-9780047","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780047","json":"https://patentable.app/api/llm-context/US-9780047","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:00:44.908Z"}