{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780056","patent":{"patent_number":"US-9780056","title":"Solder ball, manufacturing method thereof, and semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-10-19T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A solder ball includes a silver ball structure and a shell structure. The shell structure wraps a surface of the silver ball structure, and a material of the shell structure at least includes tin. When the solder ball is bonded to other devices, the ball height of the solder ball remains constant to avoid collapse."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Solder ball, manufacturing method thereof, and semiconductor device","description":"A solder ball includes a silver ball structure and a shell structure. The shell structure wraps a surface of the silver ball structure, and a material of the shell structure at least includes tin. Whe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780056","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780056","citation_suggestion":"Patentable. \"Solder ball, manufacturing method thereof, and semiconductor device\" (US-9780056). https://patentable.app/patents/US-9780056","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780056","json":"https://patentable.app/api/llm-context/US-9780056","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T18:29:16.772Z"}