{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9780061","patent":{"patent_number":"US-9780061","title":"Molded chip package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2014-05-26T00:00:00.000Z","publication_date":"2017-10-03T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of manufacturing a molded chip package is provided which comprises arranging an electronic chip on a supporting structure; forming an isolation layer at least on portions of the electronic chip; and molding an encapsulation which covers the electronic chip and the supporting structure at least partially by using a molding material comprising a matrix material and a conductive filler material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Molded chip package and method of manufacturing the same","description":"A method of manufacturing a molded chip package is provided which comprises arranging an electronic chip on a supporting structure; forming an isolation layer at least on portions of the electronic ch","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9780061","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9780061","citation_suggestion":"Patentable. \"Molded chip package and method of manufacturing the same\" (US-9780061). https://patentable.app/patents/US-9780061","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9780061","json":"https://patentable.app/api/llm-context/US-9780061","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:26:13.292Z"}