{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9785496","patent":{"patent_number":"US-9785496","title":"Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on wafers that include multiple steps for enabling NC detecteion of AACNT-TS via opens","assignee":null,"inventors":[],"filing_date":"2017-03-11T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["G06F","G06F","G06F","G06F","H01L","H01L","H01L","H01L","H01L","H01L","G06F"],"num_claims":12,"abstract":"Improved processes for manufacturing semiconductor wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured to target/expose a variety of open-circuit, short-circuit, leakage, and/or excessive resistance failure modes. Such processes include evaluating one or more Designs of Experiments (“DOEs”), each comprised of multiple NCEM-enabled fill cells, in at least two variants, targeted to the same failure mode. Such DOEs include multiple means/steps for enabling non-contact (NC) detection of AACNT-TS via opens."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on wafers that include multiple steps for enabling NC detecteion of AACNT-TS via opens","description":"Improved processes for manufacturing semiconductor wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configur","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9785496","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9785496","citation_suggestion":"Patentable. \"Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on wafers that include multiple steps for enabling NC detecteion of AACNT-TS via opens\" (US-9785496). https://patentable.app/patents/US-9785496","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9785496","json":"https://patentable.app/api/llm-context/US-9785496","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:22:37.473Z"}