{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786332","patent":{"patent_number":"US-9786332","title":"Semiconductor device package with mirror mode","assignee":null,"inventors":[],"filing_date":"2015-02-17T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["G11C","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Semiconductor device assemblies with semiconductor device packages configured to operate in mirror mode are disclosed herein. In one embodiment a semiconductor device assembly includes a first semiconductor device package attached to a front side of a support substrate, and a second semiconductor device package attached to a back side of the support substrate. The first device package includes a plurality of first package contacts having a first arrangement of corresponding pin assignments, and the second device package includes a plurality of second package contacts and a switch circuit operably coupled to the second package contacts. The switch circuit is configured to receive a switch signal via the support substrate, and to assign the second package contacts to either the first arrangement of corresponding pin assignments or a second arrangement of corresponding pin assignments based on the switch signal."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device package with mirror mode","description":"Semiconductor device assemblies with semiconductor device packages configured to operate in mirror mode are disclosed herein. In one embodiment a semiconductor device assembly includes a first semicon","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786332","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786332","citation_suggestion":"Patentable. \"Semiconductor device package with mirror mode\" (US-9786332). https://patentable.app/patents/US-9786332","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786332","json":"https://patentable.app/api/llm-context/US-9786332","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:25:33.478Z"}