{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786539","patent":{"patent_number":"US-9786539","title":"Wafer chuck","assignee":null,"inventors":[],"filing_date":"2014-07-16T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":20,"abstract":"A wafer chuck is provided. The wafer chuck includes a main body and a dielectric layer disposed over the main body. The wafer chuck also includes an electrode embedded in the dielectric layer and configured to generate an electrostatic field for retaining a wafer. The wafer chuck further includes a thermal conductive layer embedded in the main body or the dielectric layer. The thermal conductive layer has a lateral thermal conductivity greater than a vertical thermal conductivity."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer chuck","description":"A wafer chuck is provided. The wafer chuck includes a main body and a dielectric layer disposed over the main body. The wafer chuck also includes an electrode embedded in the dielectric layer and conf","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786539","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786539","citation_suggestion":"Patentable. \"Wafer chuck\" (US-9786539). https://patentable.app/patents/US-9786539","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786539","json":"https://patentable.app/api/llm-context/US-9786539","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T19:50:07.328Z"}