{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786572","patent":{"patent_number":"US-9786572","title":"Flip chip ball grid array with low impedance and grounded lid","assignee":null,"inventors":[],"filing_date":"2016-09-23T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":44,"abstract":"A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from the substrate to the lid and electrically connects the substrate and lid. The spring comprises a flat single element configured as a plurality of polygons, providing contact points, the spring substantially lying in a plane and extending substantially in a straight line, or a spiral. The spring in an electronic device such as a flip chip ball grid array having this lid and an electrical substrate with EMI emitters: (1) provides low impedance electrical connection between the electronic circuit and lid; (2) grounds the lid to the electronic circuit; (3) minimizes EMI in the electronic circuit; (4) conducts heat from the electronic circuit to the lid; or any one or combination of the foregoing features (1)-(4)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Flip chip ball grid array with low impedance and grounded lid","description":"A contact spring for placement in a gap between an electrical substrate opposite a lid (electrically conductive heat spreader) of an electronic device comprises a spring that both conducts heat from t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786572","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786572","citation_suggestion":"Patentable. \"Flip chip ball grid array with low impedance and grounded lid\" (US-9786572). https://patentable.app/patents/US-9786572","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786572","json":"https://patentable.app/api/llm-context/US-9786572","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:52:25.408Z"}