{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786592","patent":{"patent_number":"US-9786592","title":"Integrated circuit structure and method of forming the same","assignee":null,"inventors":[],"filing_date":"2015-10-30T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit structure with a back side through silicon via (B/S TSV) therein and a method of forming the same is disclosed. The method includes the steps of: receiving a wafer comprising a substrate having a front side that has a conductor thereon and a back side; forming a back side through silicon via (B/S TSV) from the back side of the substrate to penetrate the substrate; and filling the back side through silicon via (B/S TSV) with a conductive material to form an electrical connection with the conductor. Thus a back side through silicon via penetrates the back side of the substrate and electrically connects to the conductor on the front side of the substrate is formed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit structure and method of forming the same","description":"An integrated circuit structure with a back side through silicon via (B/S TSV) therein and a method of forming the same is disclosed. The method includes the steps of: receiving a wafer comprising a s","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786592","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786592","citation_suggestion":"Patentable. \"Integrated circuit structure and method of forming the same\" (US-9786592). https://patentable.app/patents/US-9786592","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786592","json":"https://patentable.app/api/llm-context/US-9786592","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:52:39.509Z"}