{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786617","patent":{"patent_number":"US-9786617","title":"Chip packages and methods of manufacture thereof","assignee":null,"inventors":[],"filing_date":"2015-11-16T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A chip package may include a die and a redistribution structure over the die. The redistribution structure may include a die, a redistribution structure over the die, and an under-bump metallurgy (UBM) structure over the redistribution structure. The UBM structure may include a central portion, a peripheral portion physically separated from and surrounding a perimeter of the central portion, and a bridging portion having a first end and a second end opposite the first end. The first end of the bridging portion may be coupled to the central portion of the UBM structure, while the second end of the bridging portion may be coupled to the peripheral portion of the UBM structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip packages and methods of manufacture thereof","description":"A chip package may include a die and a redistribution structure over the die. The redistribution structure may include a die, a redistribution structure over the die, and an under-bump metallurgy (UBM","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786617","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786617","citation_suggestion":"Patentable. \"Chip packages and methods of manufacture thereof\" (US-9786617). https://patentable.app/patents/US-9786617","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786617","json":"https://patentable.app/api/llm-context/US-9786617","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:22:57.864Z"}