{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786631","patent":{"patent_number":"US-9786631","title":"Device package with reduced thickness and method for forming same","assignee":null,"inventors":[],"filing_date":"2014-11-26T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interconnect structure over the die. The interconnect structure includes a redistribution layer extending onto the molding compound and conformal to the non-planar surface of the molding compound. The device package further includes a first connector disposed over the die and bonded to the interconnect structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Device package with reduced thickness and method for forming same","description":"A device package includes a die and a molding compound around the die. The molding compound has a non-planar surface recessed from a top surface of the die. The device package also includes an interco","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786631","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786631","citation_suggestion":"Patentable. \"Device package with reduced thickness and method for forming same\" (US-9786631). https://patentable.app/patents/US-9786631","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786631","json":"https://patentable.app/api/llm-context/US-9786631","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:20:40.825Z"}