{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9786635","patent":{"patent_number":"US-9786635","title":"Integrated circuit package assembly","assignee":null,"inventors":[],"filing_date":"2015-08-05T00:00:00.000Z","publication_date":"2017-10-10T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit package assembly includes a substrate and a first integrated circuit package over the substrate. The integrated circuit package assembly also includes a second integrated circuit package between the first integrated circuit package and the substrate. The integrated circuit package further includes solder bumps between the first integrated circuit package and the second integrated circuit package. The solder bumps are configured to electrically connect the first integrated circuit package and the second integrated circuit package. The integrated circuit package assembly further includes at least two support structures between and in direct contact with the second integrated circuit package and the substrate. The at least two support structures are configured to facilitate thermal conduction between the second integrated circuit package and the substrate without providing electrical connections."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Integrated circuit package assembly","description":"An integrated circuit package assembly includes a substrate and a first integrated circuit package over the substrate. The integrated circuit package assembly also includes a second integrated circuit","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9786635","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9786635","citation_suggestion":"Patentable. \"Integrated circuit package assembly\" (US-9786635). https://patentable.app/patents/US-9786635","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9786635","json":"https://patentable.app/api/llm-context/US-9786635","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:01:19.074Z"}