{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9789674","patent":{"patent_number":"US-9789674","title":"Bonding device and method for producing plate-shaped bonded assembly","assignee":null,"inventors":[],"filing_date":"2010-10-04T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["G02F","G02F","G02F"],"num_claims":9,"abstract":"A bonding device for charging a liquid material into a space between plate-shaped members for bonding them together in situ, in which the liquid material may be prevented from exuding from the space between the plate-shaped members. The bonding device includes pair retaining base members for retaining the pair plate-shaped members facing each other, and a retaining base member movement unit for causing movement of the retaining base members towards and away from each other. The bonding device also includes an illumination unit that illuminates curing light to a photo-curable liquid material charged between the pair plate-shaped members held by the pair retaining base members, and a sensor that detects the wetting spreading state of the liquid material charged between the pair plate-shaped members."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bonding device and method for producing plate-shaped bonded assembly","description":"A bonding device for charging a liquid material into a space between plate-shaped members for bonding them together in situ, in which the liquid material may be prevented from exuding from the space b","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9789674","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9789674","citation_suggestion":"Patentable. \"Bonding device and method for producing plate-shaped bonded assembly\" (US-9789674). https://patentable.app/patents/US-9789674","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9789674","json":"https://patentable.app/api/llm-context/US-9789674","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:37:23.028Z"}