{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793140","patent":{"patent_number":"US-9793140","title":"Staggered via redistribution layer (RDL) for a package and a method for forming the same","assignee":null,"inventors":[],"filing_date":"2016-08-24T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment staggered via redistribution layer (RDL) for a package includes a first polymer layer supported by a metal via. The first polymer layer has a first polymer via. A first redistribution layer is disposed on the first polymer layer and within the first polymer via. The first redistribution layer is electrically coupled to the metal via. A second polymer layer is disposed on the first redistribution layer. The second polymer layer has a second polymer via laterally offset from the first polymer via. A second redistribution layer is disposed on the second polymer layer and within the second polymer via. The second redistribution layer is electrically coupled to the first redistribution layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Staggered via redistribution layer (RDL) for a package and a method for forming the same","description":"An embodiment staggered via redistribution layer (RDL) for a package includes a first polymer layer supported by a metal via. The first polymer layer has a first polymer via. A first redistribution la","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793140","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793140","citation_suggestion":"Patentable. \"Staggered via redistribution layer (RDL) for a package and a method for forming the same\" (US-9793140). https://patentable.app/patents/US-9793140","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793140","json":"https://patentable.app/api/llm-context/US-9793140","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:37:38.467Z"}