{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793158","patent":{"patent_number":"US-9793158","title":"Methods of fabricating a semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-06-08T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor device, the method including forming at least one interconnection structure that includes a metal interconnection and a first insulating pattern sequentially stacked on a substrate; forming barrier patterns covering sidewalls of the interconnection structure; forming second insulating patterns at sides of the interconnection structure, the second insulating patterns being spaced apart from the interconnection structure with the barrier patterns interposed therebetween; forming a via hole in the first insulating pattern by etching a portion of the first insulating pattern, the via hole exposing a top surface of the metal interconnection and sidewalls of the barrier patterns; and forming a via in the via hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of fabricating a semiconductor device","description":"A method of fabricating a semiconductor device, the method including forming at least one interconnection structure that includes a metal interconnection and a first insulating pattern sequentially st","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793158","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793158","citation_suggestion":"Patentable. \"Methods of fabricating a semiconductor device\" (US-9793158). https://patentable.app/patents/US-9793158","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793158","json":"https://patentable.app/api/llm-context/US-9793158","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:15:46.900Z"}