{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793159","patent":{"patent_number":"US-9793159","title":"Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects","assignee":null,"inventors":[],"filing_date":"2013-09-27T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects are described. In an example, an interconnect structure for an integrated circuit includes a first layer disposed above a substrate. The first layer of the interconnect structure includes a grating of alternating metal lines and dielectric lines in a first direction. A second layer of the interconnect structure is disposed above the first layer. The second layer includes a grating of alternating metal lines and dielectric lines in a second direction, perpendicular to the first direction. Each metal line of the grating of the second layer is disposed on a recessed dielectric line composed of alternating distinct regions of a first dielectric material and a second dielectric material corresponding to the alternating metal lines and dielectric lines of the first layer of the interconnect structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects","description":"Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects are described. In an example, an interconnect structure for an integrated circuit includes a first layer d","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793159","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793159","citation_suggestion":"Patentable. \"Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects\" (US-9793159). https://patentable.app/patents/US-9793159","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793159","json":"https://patentable.app/api/llm-context/US-9793159","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:35:18.208Z"}