{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793164","patent":{"patent_number":"US-9793164","title":"Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices","assignee":null,"inventors":[],"filing_date":"2015-11-12T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","G06F","H01L","H01L","H01L","G06F","G06F","H01L","H01L","H01L"],"num_claims":19,"abstract":"Self-aligned metal cut and via for Back-End-Of-Line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices, is disclosed. In this manner, mask placement overlay requirements can be relaxed. This relaxation can be multiples of that allowed by conventional BEOL techniques. This is enabled through application of different fill materials for alternating lines in which a conductor will later be placed. With these different fill materials in place, a print cut and via mask is used, with the mask allowed to overlap other adjacent fill lines to that of the desired line. Etching is then applied that is selective to the desired line but not adjacent lines."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices","description":"Self-aligned metal cut and via for Back-End-Of-Line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices, is disclosed. In this manner, mask placem","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793164","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793164","citation_suggestion":"Patentable. \"Self-aligned metal cut and via for back-end-of-line (BEOL) processes for semiconductor integrated circuit (IC) fabrication, and related processes and devices\" (US-9793164). https://patentable.app/patents/US-9793164","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793164","json":"https://patentable.app/api/llm-context/US-9793164","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:48:19.553Z"}