{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793167","patent":{"patent_number":"US-9793167","title":"Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure","assignee":null,"inventors":[],"filing_date":"2016-07-29T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":15,"abstract":"A method of producing a semiconductor device and a wafer structure are provided. The method includes attaching a donor wafer comprising silicon carbide to a carrier wafer comprising graphite, splitting the donor wafer along an internal delamination layer so that a split layer comprising silicon carbide and attached to the carrier wafer is formed, removing the carrier wafer above an inner portion of the split layer while leaving a residual portion of the carrier wafer attached to the split layer to form a partially supported wafer, and further processing the partially supported wafer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure","description":"A method of producing a semiconductor device and a wafer structure are provided. The method includes attaching a donor wafer comprising silicon carbide to a carrier wafer comprising graphite, splittin","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793167","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793167","citation_suggestion":"Patentable. \"Method for forming a wafer structure, a method for forming a semiconductor device and a wafer structure\" (US-9793167). https://patentable.app/patents/US-9793167","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793167","json":"https://patentable.app/api/llm-context/US-9793167","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:19:43.489Z"}