{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793190","patent":{"patent_number":"US-9793190","title":"Lid for integrated circuit package","assignee":null,"inventors":[],"filing_date":"2015-03-11T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a copper substrate and a native silicon oxide layer connected to the substrate by at least one intermediate layer. A method of providing a heat path through an integrated circuit package includes providing a substrate with an exterior layer of native silicon oxide and interfacing the layer of native silicon oxide with a layer of thermal interface material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Lid for integrated circuit package","description":"A lid has a heat conductive substrate, a crystallized amorphous silicon layer and a native silicon oxide layer formed on the crystallized amorphous silicon layer. Another embodiment has a lid with a c","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793190","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793190","citation_suggestion":"Patentable. \"Lid for integrated circuit package\" (US-9793190). https://patentable.app/patents/US-9793190","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793190","json":"https://patentable.app/api/llm-context/US-9793190","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T19:32:53.375Z"}