{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793206","patent":{"patent_number":"US-9793206","title":"Heterogeneous metallization using solid diffusion removal of metal interconnects","assignee":null,"inventors":[],"filing_date":"2016-09-29T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A method for forming trenches of an interconnect network in a substrate. The method includes forming a first trench in the substrate, which has a first width. The method also includes forming a second trench in the substrate, which has a second width that is greater than the first width. The method also includes depositing a metal layer into the trenches, applying a dielectric over the metal, and diffusing metal atoms from the trenches to the dielectric. The dielectric absorbs a majority of the metal atoms from the first trench while simultaneously absorbing only a minority of metal atoms from the second trench."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Heterogeneous metallization using solid diffusion removal of metal interconnects","description":"A method for forming trenches of an interconnect network in a substrate. The method includes forming a first trench in the substrate, which has a first width. The method also includes forming a second","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793206","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793206","citation_suggestion":"Patentable. \"Heterogeneous metallization using solid diffusion removal of metal interconnects\" (US-9793206). https://patentable.app/patents/US-9793206","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793206","json":"https://patentable.app/api/llm-context/US-9793206","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:46:04.088Z"}