{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793212","patent":{"patent_number":"US-9793212","title":"Interconnect structures and methods of forming same","assignee":null,"inventors":[],"filing_date":"2015-04-16T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment semiconductor device includes a first conductive feature in a dielectric layer and a second conductive feature over the dielectric layer and electrically connected to the first conductive feature. The second conductive feature includes a dual damascene structure and further includes a top portion within both a line portion and a via portion of the second conductive feature and a bottom portion in the via portion of the second conductive feature. The bottom portion comprises a different conductive material than the top portion, and a thickness of the bottom portion is at least about twenty percent of a total thickness of the via portion of the second conductive feature."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnect structures and methods of forming same","description":"An embodiment semiconductor device includes a first conductive feature in a dielectric layer and a second conductive feature over the dielectric layer and electrically connected to the first conductiv","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793212","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793212","citation_suggestion":"Patentable. \"Interconnect structures and methods of forming same\" (US-9793212). https://patentable.app/patents/US-9793212","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793212","json":"https://patentable.app/api/llm-context/US-9793212","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:36:40.405Z"}