{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793226","patent":{"patent_number":"US-9793226","title":"Power supply transient performance (power integrity) for a probe card assembly in an integrated circuit test environment","assignee":null,"inventors":[],"filing_date":"2016-02-26T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":18,"abstract":"The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows the die to operate at package-level speed, thus reducing yield loss at the packaging level. Each embodiment addresses a slightly different aspect of the overall wafer probe application. In each embodiment, however, the critical improvement of this disclosure is the location of the passive components used for supply filtering/decoupling relative to prior art. All three embodiments require a method to embed the passive components in close proximity to the pitch translation substrate or physically in the pitch translation substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Power supply transient performance (power integrity) for a probe card assembly in an integrated circuit test environment","description":"The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793226","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793226","citation_suggestion":"Patentable. \"Power supply transient performance (power integrity) for a probe card assembly in an integrated circuit test environment\" (US-9793226). https://patentable.app/patents/US-9793226","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793226","json":"https://patentable.app/api/llm-context/US-9793226","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:45:37.084Z"}