{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793237","patent":{"patent_number":"US-9793237","title":"Hollow-cavity flip-chip package with reinforced interconnects and process for making the same","assignee":null,"inventors":[],"filing_date":"2016-03-30T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"The present disclosure relates to a flip-chip package with a hollow-cavity and reinforced interconnects, and a process for making the same. The disclosed flip-chip package includes a substrate, a reinforcement layer over an upper surface of the substrate, a flip-chip die attached to the upper surface of the substrate by interconnects through the reinforcement layer, an air cavity formed between the substrate and the flip-chip die, and a protective layer encapsulating the flip-chip die and defining a perimeter of the air cavity. Herein, a first portion of each interconnect is encapsulated by the reinforcement layer and a second portion of each interconnect is exposed to the air cavity. The reinforcement layer provides reinforcement to each interconnect."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Hollow-cavity flip-chip package with reinforced interconnects and process for making the same","description":"The present disclosure relates to a flip-chip package with a hollow-cavity and reinforced interconnects, and a process for making the same. The disclosed flip-chip package includes a substrate, a rein","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793237","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793237","citation_suggestion":"Patentable. \"Hollow-cavity flip-chip package with reinforced interconnects and process for making the same\" (US-9793237). https://patentable.app/patents/US-9793237","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793237","json":"https://patentable.app/api/llm-context/US-9793237","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T14:24:44.811Z"}