{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793241","patent":{"patent_number":"US-9793241","title":"Printed wiring board","assignee":null,"inventors":[],"filing_date":"2016-11-30T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on a first surface of the lowermost resin insulating layer, a conductor post formed in the lowermost resin insulating layer such that the conductor post has an upper surface facing the first surface and a lower surface on the opposite side with respect to the upper surface, a semiconductor element embedded in the lowermost resin insulating layer such that the semiconductor element has an electrode facing the first surface and is positioned on a second surface side of the lowermost resin insulating layer, and via conductors formed in the lowermost resin insulating layer and including a first via conductor and a second via conductor such that the first via conductor is connecting the first conductor layer and the conductor post and that the second via conductor is connecting the first conductor layer and the electrode."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Printed wiring board","description":"A printed wiring board includes a lowermost resin insulating layer, a first conductor layer formed on a first surface of the lowermost resin insulating layer, a conductor post formed in the lowermost ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793241","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793241","citation_suggestion":"Patentable. \"Printed wiring board\" (US-9793241). https://patentable.app/patents/US-9793241","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793241","json":"https://patentable.app/api/llm-context/US-9793241","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:39.874Z"}