{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793251","patent":{"patent_number":"US-9793251","title":"Semiconductor package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2015-11-30T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on which a first mounting device is mounted on a substrate that includes a circuit formed thereon, and an interconnection part configured to electrically connect the semiconductor chip to the mounting block."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method thereof","description":"Disclosed herein is a semiconductor package in which a semiconductor chip and a mounting device are packaged together. The semiconductor package includes a semiconductor chip, a mounting block on whic","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793251","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793251","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method thereof\" (US-9793251). https://patentable.app/patents/US-9793251","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793251","json":"https://patentable.app/api/llm-context/US-9793251","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T16:00:19.402Z"}