{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9793826","patent":{"patent_number":"US-9793826","title":"Method of manufacturing a circuit device","assignee":null,"inventors":[],"filing_date":"2016-01-22T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H02M","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":11,"abstract":"In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion. The circuit elements are mounted on upper surfaces of the island portions, and are connected to corresponding bonding portions by wirings. Two leads are adapted to be connected to positive and negative sides of a power source, and another lead is an output lead for providing alternating-current power. Lower surfaces of the island portions are attached to an upper surface of a circuit board. The circuit board, the circuit elements, and the lead frame are encapsulated by a resin, so that the lead portions are not covered by the resin."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of manufacturing a circuit device","description":"In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9793826","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9793826","citation_suggestion":"Patentable. \"Method of manufacturing a circuit device\" (US-9793826). https://patentable.app/patents/US-9793826","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9793826","json":"https://patentable.app/api/llm-context/US-9793826","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:21:22.012Z"}