{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9795026","patent":{"patent_number":"US-9795026","title":"Electronic package that includes finned vias","assignee":null,"inventors":[],"filing_date":"2015-12-15T00:00:00.000Z","publication_date":"2017-10-17T00:00:00.000Z","cpc_codes":["H01L"],"num_claims":14,"abstract":"The electronic package includes a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers; wherein the substrate further includes a plurality of thermal finned vias that electrically connect the conductive routings within the substrate to one another; and an electronic component mounted on the substrate, wherein the finned via transfers heat from the electronic component to the substrate and electrically connects the conductive routings within the substrate to the electronic component."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic package that includes finned vias","description":"The electronic package includes a substrate that includes a plurality of dielectric layers and conductive routings between the plurality of dielectric layers; wherein the substrate further includes a ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9795026","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9795026","citation_suggestion":"Patentable. \"Electronic package that includes finned vias\" (US-9795026). https://patentable.app/patents/US-9795026","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9795026","json":"https://patentable.app/api/llm-context/US-9795026","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:22:03.596Z"}