{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799529","patent":{"patent_number":"US-9799529","title":"Method of planarizing a film layer","assignee":null,"inventors":[],"filing_date":"2016-03-17T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor device is disclosed. The method includes forming a first flowable-material (FM) layer over a substrate. A top surface of the first FM layer in a first region is higher than a top surface of the first FM layer in a second region. The method also includes forming a sacrificial plug to cover the first FM layer in the first region, forming a second FM layer over the sacrificial plug in the first region and over the first FM layer in the second region, performing a first recessing process such that the second FM layer is removed in the first region and performing a second recessing process on the second FM layer in the second region while the first FM layer is protected by the sacrificial plug in the first region."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of planarizing a film layer","description":"A method of fabricating a semiconductor device is disclosed. The method includes forming a first flowable-material (FM) layer over a substrate. A top surface of the first FM layer in a first region is","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799529","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799529","citation_suggestion":"Patentable. \"Method of planarizing a film layer\" (US-9799529). https://patentable.app/patents/US-9799529","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799529","json":"https://patentable.app/api/llm-context/US-9799529","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:40:04.303Z"}