{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799579","patent":{"patent_number":"US-9799579","title":"Semiconductor substrate-on-semiconductor substrate package and method of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2016-12-02T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"A semiconductor assembly includes a first semiconductor substrate having a first main surface and a second main surface and a second semiconductor substrate having a first main surface and a second main surface. The first main surface of the first semiconductor substrate faces the second main surface of the second semiconductor substrate. Further, the semiconductor assembly includes a plurality of first electrodes disposed on the first main surface of the first semiconductor chip and a plurality of second electrodes disposed on the second main surface of the second semiconductor chip, wherein the first electrodes are aligned with and connected by interconnects to the second electrodes. An electrically conducting layer perforated by holes is disposed between and fixed to the first semiconductor substrate and the second semiconductor substrate, wherein the interconnects penetrate the holes. The electrically conducting layer is electrically connected to a function test electrode of the semiconductor assembly."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor substrate-on-semiconductor substrate package and method of manufacturing the same","description":"A semiconductor assembly includes a first semiconductor substrate having a first main surface and a second main surface and a second semiconductor substrate having a first main surface and a second ma","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799579","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799579","citation_suggestion":"Patentable. \"Semiconductor substrate-on-semiconductor substrate package and method of manufacturing the same\" (US-9799579). https://patentable.app/patents/US-9799579","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799579","json":"https://patentable.app/api/llm-context/US-9799579","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:15:32.619Z"}