{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799597","patent":{"patent_number":"US-9799597","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2016-03-08T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"According to one embodiment, a semiconductor package includes a first substrate, first conductive layers, first semiconductor chips, a second conductive layer, a first terminal, and a second terminal. The first substrate has a first surface. The first conductive layers are provided on the first surface. Each of the first semiconductor chips includes a first electrode and a second electrode. Each of the first conductive layers is connected to at least one of the first electrodes. The second conductive layer is provided on the first surface to be separated from the first conductive layers. The second conductive layer is connected to a plurality of the second electrodes. The first terminal is connected to the first conductive layers. Inductances between the first extension unit and each of the first conductive layers are substantially equal to each other. The second terminal is connected to the second conductive layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package","description":"According to one embodiment, a semiconductor package includes a first substrate, first conductive layers, first semiconductor chips, a second conductive layer, a first terminal, and a second terminal.","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799597","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799597","citation_suggestion":"Patentable. \"Semiconductor package\" (US-9799597). https://patentable.app/patents/US-9799597","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799597","json":"https://patentable.app/api/llm-context/US-9799597","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:35:20.253Z"}