{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799615","patent":{"patent_number":"US-9799615","title":"Package structures having height-adjusted molding members and methods of forming the same","assignee":null,"inventors":[],"filing_date":"2016-07-20T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"Package structures and methods of forming the same are disclosed. A package structure includes a die, a molding member and a redistribution circuit structure. The die includes a semiconductor substrate, a connector and a passivation layer. The semiconductor substrate has a top surface. The connector is disposed over the top surface of the semiconductor substrate. The passivation layer is disposed over the top surface of the semiconductor substrate and exposes a portion of the connector. The molding member laterally surrounds the semiconductor substrate, wherein a top surface of the molding member is higher than the top surface of the semiconductor substrate and the molding member forms a hooking structure that embraces over an edge portion of the semiconductor substrate. The redistribution circuit structure extends over the passivation layer and the molding member, and is electrically connected to the connector."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package structures having height-adjusted molding members and methods of forming the same","description":"Package structures and methods of forming the same are disclosed. A package structure includes a die, a molding member and a redistribution circuit structure. The die includes a semiconductor substrat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799615","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799615","citation_suggestion":"Patentable. \"Package structures having height-adjusted molding members and methods of forming the same\" (US-9799615). https://patentable.app/patents/US-9799615","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799615","json":"https://patentable.app/api/llm-context/US-9799615","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:27:10.398Z"}