{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799620","patent":{"patent_number":"US-9799620","title":"Warpage reduction and adhesion improvement of semiconductor die package","assignee":null,"inventors":[],"filing_date":"2015-06-30T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of forming a die package includes forming a conductive column over a first side of a carrier, attaching a semiconductor die to the first side of the carrier, and forming a molding compound over the first side of the carrier. The semiconductor die and the conductive column are embedded in the molding compound. A second side of the carrier opposite the first side is under a compressive stress. The method also includes forming a first compressive dielectric layer over the semiconductor die, the conductive column, and the molding compound, forming a first redistribution layer (RDL) over the first compressive dielectric layer, and forming a first passivation layer over the first RDL."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Warpage reduction and adhesion improvement of semiconductor die package","description":"A method of forming a die package includes forming a conductive column over a first side of a carrier, attaching a semiconductor die to the first side of the carrier, and forming a molding compound ov","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799620","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799620","citation_suggestion":"Patentable. \"Warpage reduction and adhesion improvement of semiconductor die package\" (US-9799620). https://patentable.app/patents/US-9799620","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799620","json":"https://patentable.app/api/llm-context/US-9799620","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:05:14.184Z"}