{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799628","patent":{"patent_number":"US-9799628","title":"Stacked package configurations and methods of making the same","assignee":null,"inventors":[],"filing_date":"2016-02-12T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Some examples of the disclosure may include a package on package integrated package configuration including a first die located above the substrate in a first plane, a second die located above the first die in a second plane with a portion extending past the first die, a third die located above the first die in the second plane with a portion extending past the first die, a fourth die located above the second die and the third die in a third plane with a portion extending past the second die and the third die, and a fifth die located above the second die and the third die in the third plane with a portion extending past the second die and the third die."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked package configurations and methods of making the same","description":"Some examples of the disclosure may include a package on package integrated package configuration including a first die located above the substrate in a first plane, a second die located above the fir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799628","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799628","citation_suggestion":"Patentable. \"Stacked package configurations and methods of making the same\" (US-9799628). https://patentable.app/patents/US-9799628","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799628","json":"https://patentable.app/api/llm-context/US-9799628","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:17:28.285Z"}