{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9799720","patent":{"patent_number":"US-9799720","title":"Inductor heat dissipation in an integrated circuit","assignee":null,"inventors":[],"filing_date":"2014-09-12T00:00:00.000Z","publication_date":"2017-10-24T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The present invention relates generally to semiconductor structures and methods of manufacturing and, more particularly, to improving heat dissipation of devices, such as active devices like inductors, by filling portions of the semiconductor structure with thermally conductive and electrical isolating material that may serve as a heat sink to a base substrate. In an embodiment, an inductor may be formed above a cavity region in which the thermally conductive and electrical isolating material has been formed. Heat may then be dissipated from the inductor to the cavity, and eventually to the base substrate, through trenches filled with the thermally conductive and electrical isolating material."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Inductor heat dissipation in an integrated circuit","description":"The present invention relates generally to semiconductor structures and methods of manufacturing and, more particularly, to improving heat dissipation of devices, such as active devices like inductors","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9799720","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9799720","citation_suggestion":"Patentable. \"Inductor heat dissipation in an integrated circuit\" (US-9799720). https://patentable.app/patents/US-9799720","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9799720","json":"https://patentable.app/api/llm-context/US-9799720","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T20:42:03.918Z"}