{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9802813","patent":{"patent_number":"US-9802813","title":"Wafer level package for a MEMS sensor device and corresponding manufacturing process","assignee":null,"inventors":[],"filing_date":"2015-09-21T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer level package for a MEMS sensor device and corresponding manufacturing process","description":"A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an elect","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9802813","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9802813","citation_suggestion":"Patentable. \"Wafer level package for a MEMS sensor device and corresponding manufacturing process\" (US-9802813). https://patentable.app/patents/US-9802813","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9802813","json":"https://patentable.app/api/llm-context/US-9802813","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:40:02.498Z"}