{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9805943","patent":{"patent_number":"US-9805943","title":"Polymer for resist under layer film composition, resist under layer film composition, and patterning process","assignee":null,"inventors":[],"filing_date":"2016-03-04T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":32,"abstract":"The invention provides a polymer for a resist under layer film composition, containing a repeating unit shown by the formula (1) and a repeating unit shown by the formula (3),wherein R01 independently represents a hydrogen atom or a methyl group; R02 represents a group selected from the formulae (1-1) to (1-3); R03 represents a saturated or unsaturated tertiary alkyl group having 4 to 20 carbon atoms and optionally containing an oxygen functional group; and A2 represents a single bond or a divalent linking group having 2 to 10 carbon atoms and containing an ester group,wherein the dotted line represents a bonding arm. There can be provided a polymer for a resist under layer film composition that is capable of forming a resist under layer film having good alkali aqueous hydrogen peroxide resistance, excellent filling and planarizing properties, and excellent dry etching property"},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Polymer for resist under layer film composition, resist under layer film composition, and patterning process","description":"The invention provides a polymer for a resist under layer film composition, containing a repeating unit shown by the formula (1) and a repeating unit shown by the formula (3),wherein R01 independently","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9805943","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9805943","citation_suggestion":"Patentable. \"Polymer for resist under layer film composition, resist under layer film composition, and patterning process\" (US-9805943). https://patentable.app/patents/US-9805943","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9805943","json":"https://patentable.app/api/llm-context/US-9805943","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:17:43.938Z"}