{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9805951","patent":{"patent_number":"US-9805951","title":"Method of integration process for metal CMP","assignee":null,"inventors":[],"filing_date":"2016-04-15T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate. The substrate has an edge region and a center region. The method also includes forming a dielectric ring in the edge region, forming a metal layer over the center region of the substrate and over the dielectric ring in the edge region of the substrate and polishing the metal layer in the center region and the edge region to expose the dielectric ring in the edge region of the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of integration process for metal CMP","description":"A method of fabricating a semiconductor device is disclosed. The method includes forming a dielectric layer over a substrate. The substrate has an edge region and a center region. The method also incl","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9805951","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9805951","citation_suggestion":"Patentable. \"Method of integration process for metal CMP\" (US-9805951). https://patentable.app/patents/US-9805951","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9805951","json":"https://patentable.app/api/llm-context/US-9805951","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:47:47.884Z"}