{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9805971","patent":{"patent_number":"US-9805971","title":"Method of forming a via contact","assignee":null,"inventors":[],"filing_date":"2015-03-16T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Semiconductor device and method for forming a semiconductor device are presented. The method includes providing a substrate having a device component with a contact region. A contact dielectric layer is formed on the substrate. The contact dielectric layer covers the substrate and device component. At least one contact opening is formed through the contact dielectric layer. Upper portion of the contact opening includes wider opening with tapered sidewall profile while lower portion of the contact opening includes narrower opening with vertical sidewall profile."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of forming a via contact","description":"Semiconductor device and method for forming a semiconductor device are presented. The method includes providing a substrate having a device component with a contact region. A contact dielectric layer ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9805971","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9805971","citation_suggestion":"Patentable. \"Method of forming a via contact\" (US-9805971). https://patentable.app/patents/US-9805971","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9805971","json":"https://patentable.app/api/llm-context/US-9805971","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:40:43.061Z"}