{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806000","patent":{"patent_number":"US-9806000","title":"Semiconductor device and manufacturing method of semiconductor device","assignee":null,"inventors":[],"filing_date":"2016-07-22T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":5,"abstract":"A bonding member is a member shaped in a sheet and made of electrically-insulating resin. A semiconductor module includes a heatsink and a cooler that are electrically insulated from each other by the bonding member. The bonding member includes a central portion and a peripheral portion. A heat conductivity in a normal direction of the central portion is greater than a heat conductivity in the normal direction of the peripheral portion. Further, a heat conductivity in a surface direction of the peripheral portion is greater than a heat conductivity in the surface direction of the central portion. Further, the heat conductivity in the normal direction of the central portion is greater than the heat conductivity in the surface direction of the central portion."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and manufacturing method of semiconductor device","description":"A bonding member is a member shaped in a sheet and made of electrically-insulating resin. A semiconductor module includes a heatsink and a cooler that are electrically insulated from each other by the","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806000","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806000","citation_suggestion":"Patentable. \"Semiconductor device and manufacturing method of semiconductor device\" (US-9806000). https://patentable.app/patents/US-9806000","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806000","json":"https://patentable.app/api/llm-context/US-9806000","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:05:17.361Z"}