{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806036","patent":{"patent_number":"US-9806036","title":"Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer","assignee":null,"inventors":[],"filing_date":"2016-11-17T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer periphery of the main body, including a first slope connecting the first and second surfaces and having a first height with respect to a straight line extending from a first point where the first surface and the first slope meet to a second point where the second surface and the first slope meet, and a second bevel region in contact with the recess or opening, including a second slope connecting the first and second surfaces and having a second height, different from the first height, with respect to a straight line extending from a third point where the first surface and the second slope meet to a fourth point where the second surface and the second slope meet."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer","description":"A semiconductor wafer including a main body including first and second surfaces opposite each other, a notch including a recess on an outer periphery, a first bevel region formed along the outer perip","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806036","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806036","citation_suggestion":"Patentable. \"Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer\" (US-9806036). https://patentable.app/patents/US-9806036","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806036","json":"https://patentable.app/api/llm-context/US-9806036","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:36:21.440Z"}