{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806045","patent":{"patent_number":"US-9806045","title":"Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface","assignee":null,"inventors":[],"filing_date":"2013-08-29T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a carrier, an under bump metallurgy (UBM) pad on the carrier, and a post on a surface of the UBM pad. In some embodiments, a height of the post to a longest length of the UBM pad is between about 0.25 and about 0.7. A method of manufacturing a semiconductor device includes providing a carrier, disposing a UBM pad on the carrier and forming a post on the UBM pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface","description":"A semiconductor device includes a carrier, an under bump metallurgy (UBM) pad on the carrier, and a post on a surface of the UBM pad. In some embodiments, a height of the post to a longest length of t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806045","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806045","citation_suggestion":"Patentable. \"Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface\" (US-9806045). https://patentable.app/patents/US-9806045","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806045","json":"https://patentable.app/api/llm-context/US-9806045","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:20:54.772Z"}