{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806050","patent":{"patent_number":"US-9806050","title":"Method of fabricating package structure","assignee":null,"inventors":[],"filing_date":"2015-06-17T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of fabricating package structure","description":"A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner t","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806050","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806050","citation_suggestion":"Patentable. \"Method of fabricating package structure\" (US-9806050). https://patentable.app/patents/US-9806050","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806050","json":"https://patentable.app/api/llm-context/US-9806050","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:33:47.175Z"}