{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806061","patent":{"patent_number":"US-9806061","title":"Bumpless wafer level fan-out package","assignee":null,"inventors":[],"filing_date":"2016-03-31T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An integrated circuit package may include a first conductive pad on an interposer substrate, and a second conductive pad formed on a front surface of an integrated circuit die. The second conductive pad may directly contact the first conductive pad on the interposer substrate. The integrated circuit package may further include a package substrate having a cavity, in which the interposer substrate and the integrated circuit are disposed in the cavity. The interposer substrate may include interconnect pathways that are electrically coupled to the first and second conductive pads. A heat spreader may subsequently form over the integrated circuit die and the package substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Bumpless wafer level fan-out package","description":"An integrated circuit package may include a first conductive pad on an interposer substrate, and a second conductive pad formed on a front surface of an integrated circuit die. The second conductive p","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806061","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806061","citation_suggestion":"Patentable. \"Bumpless wafer level fan-out package\" (US-9806061). https://patentable.app/patents/US-9806061","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806061","json":"https://patentable.app/api/llm-context/US-9806061","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:49:39.402Z"}