{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806062","patent":{"patent_number":"US-9806062","title":"Methods of packaging semiconductor devices and packaged semiconductor devices","assignee":null,"inventors":[],"filing_date":"2016-07-18T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device also includes a molding material disposed over the substrate between adjacent ones of the plurality of integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies, wherein the cap layer comprises an electrically conductive material that directly contacts the molding material and each of the plurality of integrated circuit dies."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Methods of packaging semiconductor devices and packaged semiconductor devices","description":"Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806062","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806062","citation_suggestion":"Patentable. \"Methods of packaging semiconductor devices and packaged semiconductor devices\" (US-9806062). https://patentable.app/patents/US-9806062","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806062","json":"https://patentable.app/api/llm-context/US-9806062","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:22:52.764Z"}