{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806067","patent":{"patent_number":"US-9806067","title":"Die-die stacking","assignee":null,"inventors":[],"filing_date":"2015-07-20T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A semiconductor die is provided with an optical transmitter configured to transmit an optical signal to another die and an optical receiver configured to receive an optical signal from another die. Furthermore, a method of forming a semiconductor device is provided including forming a first semiconductor die with the steps of providing a semiconductor substrate, forming a transistor device at least partially over the semiconductor substrate, forming an optical receiver one of at least partially over and at least partially in the semiconductor substrate, forming a metallization layer over the transistor device, and forming an optical transmitter one of at least partially over the metallization layer and at least partially in the metallization layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Die-die stacking","description":"A semiconductor die is provided with an optical transmitter configured to transmit an optical signal to another die and an optical receiver configured to receive an optical signal from another die. Fu","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806067","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806067","citation_suggestion":"Patentable. \"Die-die stacking\" (US-9806067). https://patentable.app/patents/US-9806067","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806067","json":"https://patentable.app/api/llm-context/US-9806067","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:24:11.632Z"}