{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9806390","patent":{"patent_number":"US-9806390","title":"Radio frequency die package with inverted ground plane and method of making same","assignee":null,"inventors":[],"filing_date":"2017-02-10T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Radio frequency die package with inverted ground plane and method of making same","description":"A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectiv","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9806390","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9806390","citation_suggestion":"Patentable. \"Radio frequency die package with inverted ground plane and method of making same\" (US-9806390). https://patentable.app/patents/US-9806390","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9806390","json":"https://patentable.app/api/llm-context/US-9806390","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:42:41.383Z"}