{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9807874","patent":{"patent_number":"US-9807874","title":"Wiring substrate, component embedded substrate, and package structure","assignee":null,"inventors":[],"filing_date":"2012-09-29T00:00:00.000Z","publication_date":"2017-10-31T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A wiring substrate for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure including an electronic component mounted on the wiring substrate or the component embedded substrate. The wiring substrate includes a metal plate, and a wiring layer including a plurality of insulating layers and a conductive layer arranged on the plurality of insulating layers arranged on at least one principal surface of the metal plate. The plurality of insulating layers includes a first insulating layer to contact the principal surface of the metal plate and has a larger thermal expansion rate in the planar direction than the metal plate and a second insulating layer which is laminated on the first insulating layer to contact the first insulating layer and has smaller thermal expansion rate in the planar direction than the metal plate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wiring substrate, component embedded substrate, and package structure","description":"A wiring substrate for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package st","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9807874","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9807874","citation_suggestion":"Patentable. \"Wiring substrate, component embedded substrate, and package structure\" (US-9807874). https://patentable.app/patents/US-9807874","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9807874","json":"https://patentable.app/api/llm-context/US-9807874","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:21:29.226Z"}